Behind the Scenes of Innovation with Mike Dodd

02/26/24 • 19 min

Join Host Civilian Sydney for Episode 3 of the Defense Tech Podcast as she sits down with Mike Dodd, VP of Strategic Partnerships at NTSXL, to take a look at the current climate in government innovation. Using his extensive background in both military and industry, Mike provides insights into the issues currently facing U.S. national security, such as the Chips Crisis, and how the Microelectronics Commons program is situated to make a difference.

Learn more about NSTXL: www.nstxl.org

Learn more about NSTXL: www.nstxl.org

Previous Episode

Behind the Scenes of Innovation with Tim Greeff

Join Host Civilian Sydney for Episode 2 of The Defense Tech Podcast as she sits down with NSTXL President & Founder Tim Greeff to take a look behind the scenes of innovation. In this episode, Tim shares his high-level insight into the launch of Microelectronics Commons, its infrastructure and how he sees this project changing the future of Defense Contracting.

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Learn more about NSTXL: https://www.nstxl.org

Learn more about Commons: https://www.microelectronicscommons.org

Next Episode

Behind the Scenes of Innovation with Mike Brockly

Join Host Civilian Sydney for Episode 4 of the Defense Tech Podcast for the final episode of the Behind the Scenes of Innovation series, as she sits down with Mike Brockly, Director of Program Management at NTSXL, to take a look at security measures in the United States, security implications of the Chips Crisis and project success and evaluation for Microelectronics Commons. Using his holistic security background, Mike breaks down the status of security in the U.S. and what he looks forward to seeing come to life with the Commons project. Stay tuned for future episodes, and be sure to watch last week's episode with Mike Dodd, VP of Strategic Partnerships at NSTXL.

Follow NSTXL on LinkedIn: linkedin.com / national-security-technology-accelerator