A Conversation With the SEMI Market Intelligence Team About the Equipment Market
Explicit content warning
06/23/22 • 21 min
We are excited to share that we’ve partnered with SEMI’s Market Intelligence team to bring you quarterly semiconductor industry market updates. Each episode will feature one of SEMI’s market analysts, who will discuss different market trends driving specific areas of the market. They’ll also provide some high-level intelligence to help you in your day-to-day business decisions. In this first episode, we’re focusing on the Semiconductor Manufacturing Equipment Market. Guests include Sanjay Malhotra, Vice President of Corporate Marketing and the Market Intelligence Team, and Inna Skvortsova, one of the Analysts in the Market Intelligence Group.
Sanjay kicks off the conversation by providing information on the SEMI Market Intelligence team. He talks about the value he gained as a customer of SEMI reports during his tenure at Applied Materials. He describes the different offerings, and explains who uses SEMI data, and how.
Then, Inna dives into the reporting. She explains how the data is gathered, and how they ensure the reliability of the reports. In addition to providing some details on current year equipment market growth, she talks about the impact of the chip shortage on the equipment manufacturers, supply chain constraints, and other potential headwinds.
You can learn more about SEMI Market Reports here. Fo specific questions, email the Market Intelligence team at [email protected].
Find our Guests on LinkedIn:
· Sanjay Malhotra, VP of Corporate Marketing and the Market Intelligence Team
· Inna Skvortsova, Market Analyst
SEMIA global association, SEMI represents the entire electronics manufacturing and design supply chain.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
We are excited to share that we’ve partnered with SEMI’s Market Intelligence team to bring you quarterly semiconductor industry market updates. Each episode will feature one of SEMI’s market analysts, who will discuss different market trends driving specific areas of the market. They’ll also provide some high-level intelligence to help you in your day-to-day business decisions. In this first episode, we’re focusing on the Semiconductor Manufacturing Equipment Market. Guests include Sanjay Malhotra, Vice President of Corporate Marketing and the Market Intelligence Team, and Inna Skvortsova, one of the Analysts in the Market Intelligence Group.
Sanjay kicks off the conversation by providing information on the SEMI Market Intelligence team. He talks about the value he gained as a customer of SEMI reports during his tenure at Applied Materials. He describes the different offerings, and explains who uses SEMI data, and how.
Then, Inna dives into the reporting. She explains how the data is gathered, and how they ensure the reliability of the reports. In addition to providing some details on current year equipment market growth, she talks about the impact of the chip shortage on the equipment manufacturers, supply chain constraints, and other potential headwinds.
You can learn more about SEMI Market Reports here. Fo specific questions, email the Market Intelligence team at [email protected].
Find our Guests on LinkedIn:
· Sanjay Malhotra, VP of Corporate Marketing and the Market Intelligence Team
· Inna Skvortsova, Market Analyst
SEMIA global association, SEMI represents the entire electronics manufacturing and design supply chain.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Previous Episode
Conversations from the ECTC 2022 Technology Corner
Françoise hit Technology Corner at the IEEE Electronic Components Technology Conference 2022, May 31-June 3, interviewing 3D InCites member companies about being back in person, and their perspectives of some of the key industry challenges such as supply chain issues, sustainability; diversity, equity, and inclusion efforts, new technology advancements, and much more.
Tanja Braun, Fraunhofer - IZM, accepted the 3D InCites Award and shared some of the results of the PLP consortium 2.0. We talked about the challenges of standardizing panel sizes, the progress made, and what’s next for a possible third-phase of development.
Diane Scheele, EMD, Ken Araujo, Namics; and Dean Payne, Indium all talk about the challenges materials suppliers in meeting sustainability requirements for semiconductor and microelectronics manufacturing.
John Park, Cadence, talks about how EDA tools for packaging have evolved from PCB based to chip design based. He also talked about the company’s new Thermal Solver tool, Celsius.
Patrick Parin, Micross, talks about the supply chain shortages, how it’s impacting the company, and the steps they are taking to anticipate and mitigate the situation.
Robert Avila, Finetech, talks about the company’s new die bonding platform, Pico 2. He also talked about dealing with lead times and price increases as part of the supply chain shortage.
Robin Davis, Deca, talks about the company’s Diversity Equity and Inclusion initiative that she leads, and what she likes about working there.
Dick Otte, QP Technologies, talk
Real Talk About MarketingAn Acxiom podcast where we discuss marketing made better, bringing you real...
Listen on: Apple Podcasts Spotify
Digital Disruption with Geoff NielsonDiscover how technology is reshaping our lives and livelihoods.
Listen on: Apple Podcasts Spotify
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
Next Episode
Conversations from the 2022 IMAPS SiP Conference Part 1
Qualcomm’s Chidi Chidambaram talks about system technology co-optimization; ASE’s Mark Gerber Talks about the VIPack Platform; Daniel Graf, Zero EC, talks about solving data bottlenecks.
This episode was recorded live at the 2022 IMAPS Advanced SiP Conference, where the focus is on SiP technology developments, solutions and business trends. The first interview is with keynote speaker, Chidi Chidambaram, Qualcomm, who talked about system-level optimization opportunities and challenges in the era of slowing silicon process technology. In this podcast interview, Chidambaram explained why Qualcomm is not at the forefront of 3D IC and has focused on SiP solutions. He shared some of the key takeaways from his talk and answered Françoise’s questions about what he calls the connected intelligent edge, and why that’s important for the microelectronics industry. He also discusses the company’s position on chiplet technologies, and why it will be some time before they consider it for mobile applications.
Mark Gerber unpacks ASE’s new platform, VIPack. He talks about the motivation behind the platform. The capabilities of its core technologies and target applications. He also discusses the company’s role in the Universal Chiplet Integration Express (UCIe) as an effort to develop standardization for interfaces.
Daniel Graf, head of business development at Zero EC. The EC stands for Energy Connection. This start-up is an IP developer for semiconductor applications to solve data transport bottlenecks. He explains the challenges of data transfer, and how much energy is wasted during the process. Graf describes the solution his company has come up with to solve the issue.
Guest Contacts
An Acxiom podcast where we discuss marketing made better, bringing you real...
Listen on: Apple Podcasts Spotify
Digital Disruption with Geoff NielsonDiscover how technology is reshaping our lives and livelihoods.
Listen on: Apple Podcasts Spotify
KiterocketA global strategic marketing agency serving the semiconductor and sustainability industries.
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2024 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.
If you like this episode you’ll love
Episode Comments
Generate a badge
Get a badge for your website that links back to this episode
<a href="https://goodpods.com/podcasts/3d-incites-podcast-236316/a-conversation-with-the-semi-market-intelligence-team-about-the-equipm-26375612"> <img src="https://storage.googleapis.com/goodpods-images-bucket/badges/generic-badge-1.svg" alt="listen to a conversation with the semi market intelligence team about the equipment market on goodpods" style="width: 225px" /> </a>
Copy