A Conversation about Microelectronics Events of the Future

09/09/21 • 25 min

In a global industry that relies heavily on collaboration, COVID 19 created a big pause and pivot in one of the key business development tools of the microelectronics industry: technology conferences and trade shows. In this podcast, we’re talking to several industry event organizers to get their take on the past year of what worked, what didn’t, and thoughts about the future of industry events as we transition back to in-person meetings.

Rich Rice, head of marketing for North America at ASE, represented IMAPS as he completes his year as society president. He talked about the challenge of providing the type of content expected by its members in a new and interesting way. Dave Anderson, President of the Americas for SEMI, offers some insight on the advantages of virtual events with regard to tracking and metrics, and how SEMI has worked to improve the experience for its members throughout the pandemic.

We talk about how everyone is craving a return to face-to-face activities, how that may roll out with local events first, hopefully, followed by international events, and how to implement a hybrid model going forward. We also talk about how the combination of COVID and an increased concern for a sustainable future is impacting how our industry conducts business, and what that may mean for business travel going forward.

Find more information on IMAPS global events at IMAPS.org

Find more information on SEMI global events at SEMI.org

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Find more information on IMAPS global events at IMAPS.org

Find more information on SEMI global events at SEMI.org

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Previous Episode

A Conversation about the European Semiconductor Market and the Supply Chain

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Over the last 18 months, the European semiconductor industry has felt the repercussions of supply chain interruptions due COVID 19 and trade wars, combined with exploding global demand for chips driven by the digital transformation. There are also questions about regional sovereignty and the need to strengthen the local supply chain. To address these topics and more, SEMI Europe is holding its first in-person event since the start of COVID. Aiming at facilitating mutual engagement, the SEMI Packaging Technology Seminar will foster collaboration among semiconductor packaging, assembly, test manufacturing, and design experts, to collectively strengthen the semiconductor back-end industry in Europe.

In this episode, we speak with Steffen Krohnert, ESPAT Consulting, and Christian Roessle MSE Group about the semiconductor supply challenges Europe is facing, particularly for low-volume advanced packaging, and how members of the SEMI integrated Packaging, Assembly and Test Technology Community (ESiPAT-TC), are addressing them. We also talk about the upcoming seminar, and what attendees will gain by attending.
To learn more about SEMI Europe's Packaging Technology Seminar, visit the website here.
Contact Steffen Kröhnert at ESPAT Consulting
Contact Christian Roessle at MST Group

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Next Episode

A Conversation about The Importance of Package Design for Chiplet Integration

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Chiplets are the new “It” heterogeneous integration technology. Many believe they provide the solution to power, performance, area and cost (PPAC) for everything from mobile computing and automotive applications, to 5G, high-performance computing, and artificial intelligence. In this podcast episode, Françoise speaks with 3D InCites’ Community Members, Kevin Rinebold of Siemens EDA, and Robin Davis of Deca to explore how successful chiplet integration begins with a collaborative design flow.

To get started, we’ll get some of the chiplet back-stories, beginning with the advantages of disaggregating SoC into hardened IP blocks of different nodes, and reintegrating them on an “interconnect fabric.” From there, we define what we mean by chiplets, what differentiates them from system-in-package, and how different advanced packaging architectures can be implemented to create chiplet packaging. We also discuss the main challenges of designing chiplet packages; such as who owns the design? Is it the IC designer or package designer? How do we manage the die shift? How do we manage multiple designs?

Additionally, Kevin and Robin talk about their companies’ respective design kits, and how they are working together to enable a chiplet ecosystem.

Papers/presentations referenced by Kevin and Robin include:

Using a System Technology Co-Optimization Approach for 2.5/3D Heterogeneous Semiconductor Integration – Siemens EDA

Adaptive Patterning Techniques for the Chiplet Era – Deca

Contact the Speakers on LinkedIn:
Kevin Rinebold
Robin (Gabriel) Davis

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3D InCites Podcast - A Conversation about Microelectronics Events of the Future

Transcript

Kiterocket Ad00:00:01.320

Today's podcast is brought to you by Kiterocket, a global full service, strategic marketing branding, and public relations agency, serving the semiconductor and microelectronics industries. To learn more about Kiterocket. Visit the website at kiterocket.com.

Francoise von Trapp00:00:21.449

Hi there, I'm Francoise von Trapp, and

Francoise von Trapp00:00:24.210

this is the 3D InCit