3D InCites Podcast Extra: What is IMAPS CHIPCon and Why Should You Attend?

06/30/23 • 20 min

In this special episode of the 3D InCites Podcast, in partnership with the International Microelectronics and Packaging Society (IMAPS), we talk to Steve Kummerl,TI; and Mark Gerber, ASE, about the upcoming CHIPcon event which takes place July 24-27 in San Jose CA. This conference is a rebrand and restructuring of what was formerly the Advanced System in Packaging Symposium. Kummerl is the General Chair for the event, and Gerber is on the IMAPS Academic Committee. They are part of the team that put together a very robust agenda, with expert speakers from across the chiplet ecosystem.

CHIPCon stands for Chiplet Heterogeneous Integration and Packaging Conference. Kummerl and Gerber talk about the motivation for repositioning the conference, and how the speakers were selected to represent the end-to-end chiplet ecosystem. They also explain how CHIPCon is differentiated from the annual IMAPS International Device Packaging Conference. They provide some details of what attendees can expect to learn by attending this event.

Note that Early Bird Registration AND the hotel block ends today, June 30, 2023. Registration for both is found at www.chipcon.org.

IMAPS International
IMAPS is the largest society dedicated to microelectronics and electronics packaging advancement.
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Note that Early Bird Registration AND the hotel block ends today, June 30, 2023. Registration for both is found at www.chipcon.org.

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Previous Episode

The Password is Hybrid Bonding – Insights from ECTC 2023

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This episode of the 3D InCites podcast is brought to you by our sustaining members. Shout out to our first official sustaining members Lori McDonald of Deca, and Brian Schieman, of IMAPS. Thanks for helping us continue to create great content!

At ECTC 2023, which took place earlier this month, the password was hybrid bonding. In this episode, you’ll hear from our member companies that specialize in hybrid bonding solutions: Adeia, EV Group, and Onto Innovation. You’ll also hear about a novel die-to-wafer process technology from CEA Leti, and an alternative to Die-to-wafer hybrid bonding being developed by the UCLA CHIPS program.

Thomas Uhrmann, Markus Wimplinger, and Dave Kirsch, EVGroup, talk about the company’s capabilities in supporting both wafer-to-wafer hybrid bonding, and the work being done at the Heterogeneous Integration Competency Center in Austria.

Adeia’s Laura Mirkarimi and Abul Nuruzzaman, pioneers of hybrid bonding, help dispel some misconceptions about the commercialization of Die-to-wafer hybrid bonding. They talk about the advantages of investing in not only the technology license but the technology transfer.

Monica Pau, Onto Innovation, talks about the events focused on hybrid bonding, but also some insights into glass core IC substrates, and Onto Innovation's capabilities in both.

Emilie Bourjot, CEA-Leti, describes a novel self-assembly process that allows for improved alignment accuracy and increased throughput during die-to-wafer hybrid bonding.

Subu Iyer, of UCLA CHIPS, offers a new approach to copper-to-copper thermocompression bonding that he says provides an alternative to die-to-wafer hybrid bonding.

Next up on the 3D InCites Podcast: On July 6, Dave Thomas, of KLA’s SPTS division will talk about the advantages of plasma

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Next Episode

KLA’s Dave Thomas Talks about Advanced Plasma Processes for Wafer Level Packaging

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Françoise von Trapp interviews Dave Thomas, of the SPTS Division at KLA, to talk about the evolution of wafer-level packaging, what’s been driving the market to adopt more advanced processes over the past 20 years, and the role KLA and specifically the SPTS division has played in bringing these technologies to commercialization.

The specific technology focus is on plasma dicing, its uses, particularly in die-to-wafer hybrid bonding, and the path to adoption. Thomas addresses in detail some of the process challenges and how SPTS has addressed them. He also talks about the fast-moving technical requirements that make the processes for packaging applications highly competitive.

To learn more about plasma dicing, read this article published by KLA on 3D InCites.

KLA, SPTS Division
KLA provides semiconductor equipment for metrology, inspection, wafer processing, and more.
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